Prognostics and Health Management
Member
Alumni
Failure Mechanism-based Reliability
Assessment Framework for Lifetime Estimation: Case Study on an Automotive Component
Warpage Analysis during Fan-Out Wafer Level Packaging Process using Finite Element Analysis Current position : Samsung Electronics
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Development of an On-chip Health Monitoring System for Solder Joints using Bit Error Rates
An Approach to Assess Solder Interconnect Degradation Using Digital Signal