Prognostics and Health Management
Publications
Journal
Reliability Assessment of Low-Power Processor Packages in Supercomputing Systems
Nanoscience and Nanotechnology Letters, IF: 2.917, 26.03%
Shin, I., and Kwon, D., 2017, 9(8), 1241-1245
Industry 4.0: A Special Section in IEEE Access
IEEE Access, IF: 3.557, 16.22%
Su, S.*, Rudas, I., Zurada, J., Er, M., Chou, J., and Kwon, D., 2017, 5, 12257-12261
Reliability Assessment and Prediction of Solder Joints in High Temperature Heate…
Journal of Microelectronics and Packaging Society,
Park, E., Kwon, D.*, Sa, Y., 2017, 24(2), 23-27
A Digital Technique for Diagnosing Interconnect Degradation by Using Digital Sig…
Microelectronics Journal, IF: 1.322, 67.31%
Lee, J., and Kwon, D., 2017, 60, 87-93
IoT-Based Prognostics and Systems Health Management for Industrial Applications
Kwon, D.*, Hodkiewicz, M., Fan, J., Shibutani, T., and Pecht, M, 2016, 4, 3659-3670
A Model-based Prognostic Approach to Predict Remaining Useful Life of Interconne…
Journal of Mechanical Science and Technology, IF: 1.194, 66.41%
Kwon, D.* and Yoon, J, 2016, 30(10), 4447-4452
Detection of MLCC Failure Precursors based on Symbolic Time Series Analysis
Park, J., and Kwon, D., 2016, 8(1), 75-80
Reliability Assessment of Low-Power Processor Packages for Supercomputers
Park, J., and Kwon, D., 2016, 23(2), 37-42
Remaining Life Prediction of Solder Joints Using RF Impedance Analysis and Gauss…
IEEE Transactions on Components, Packaging and Manufacturing Technology, IF: 1.660, 54.62%
Kwon, D.*, Azarian, M. H., and Pecht, M., 2015, 5(11), 1602-1609
Optimal Interval Censoring Design for Reliability Prediction of Electronic Packa…
Kwon, D.*, and Shin, I., 2015, 22(2), 1-4
Failure Prediction of Multilayer Ceramic Capacitors (MLCCs) under Temperature-Hu…
Kwon, D.*, Azarian, M. H., and Pecht, M, 2013, 20(3), 1-4
Non-Destructive Sensing of Interconnect Failure Mechanisms using Time Domain Ref…
IEEE Sensors Journal, IF: 2.617, 22.95%
Kwon, D., Azarian, M. H.*, and Pecht, M., 2011, 11(5), 1236-1241
Prognostics of Interconnect Degradation using RF Impedance Monitoring and Sequen…
International Journal of Perfomability Engineering,
Kwon, D., Azarian, M. H.*, and Pecht, M., 2010, 6(5), 443-452
Early Detection of Interconnect Degradation by Continuous Monitoring of RF Imped…
IEEE Trans. on Device and Materials Reliability, IF: 1.512, 60.00%
Kwon, D., Azarian, M. H.*, and Pecht, M., 2009, 9(2), 296-304
