Prognostics and Health Management
Publications
Journal
Remaining Life Prediction of Solder Joints Using RF Impedance Analysis and Gauss…
IEEE Transactions on Components, Packaging and Manufacturing Technology, IF: 1.660, 54.62%
Kwon, D.*, Azarian, M. H., and Pecht, M., 2015, 5(11), 1602-1609
Optimal Interval Censoring Design for Reliability Prediction of Electronic Packa…
Journal of Microelectronics and Packaging Society,
Kwon, D.*, and Shin, I., 2015, 22(2), 1-4
Failure Prediction of Multilayer Ceramic Capacitors (MLCCs) under Temperature-Hu…
Kwon, D.*, Azarian, M. H., and Pecht, M, 2013, 20(3), 1-4
Non-Destructive Sensing of Interconnect Failure Mechanisms using Time Domain Ref…
IEEE Sensors Journal, IF: 2.617, 22.95%
Kwon, D., Azarian, M. H.*, and Pecht, M., 2011, 11(5), 1236-1241
Prognostics of Interconnect Degradation using RF Impedance Monitoring and Sequen…
International Journal of Perfomability Engineering,
Kwon, D., Azarian, M. H.*, and Pecht, M., 2010, 6(5), 443-452
Early Detection of Interconnect Degradation by Continuous Monitoring of RF Imped…
IEEE Trans. on Device and Materials Reliability, IF: 1.512, 60.00%
Kwon, D., Azarian, M. H.*, and Pecht, M., 2009, 9(2), 296-304