Reliability Assessment and Prediction of Solder Joints in High Temperature Heaters > Journal

Reliability Assessment and Prediction of Solder Joints in High Temperature Heaters

Author: Park, E., Kwon, D.*, Sa, Y.

Year: 2017

Journal: Journal of Microelectronics and Packaging Society

Vol: 24(2)

Page: 23-27

Link: http://www.koreascience.or.kr/article/JAKO201724854218103.page 246회 연결

Park, E., Kwon, D.*, Sa, Y., (2017) “Reliability Assessment and Prediction of Solder Joints in High Temperature Heaters,” Journal of Microelectronics and Packaging Society, vol. 24(2), pp. 23-27.