Warpage Analysis during Fan-Out Wafer Level Packaging Process using Finite Element Analysis > Journal

Warpage Analysis during Fan-Out Wafer Level Packaging Process using Finite Element Analysis

Author: Kim, G., and Kwon, D.

Year: 2018

Journal: Journal of Microelectronics and Packaging Society

Vol: 25(1)

Page: 41-45.

Link: https://scienceon.kisti.re.kr/srch/selectPORSrchArticle.do?cn=JAKO2018… 351회 연결

Kim, G., and Kwon, D.*, (2018) “Warpage Analysis during Fan-Out Wafer Level Packaging Process using Finite Element Analysis,” Journal of Microelectronics and Packaging Society, vol. 25(1), pp. 41-45.