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Effect of Material Property Uncertainty on Warpage during Fan Out Wafer-Level Packaging Process

Author: Kim, G., Kang, G., and Kwon, D.

Year: 2019

Journal: Journal of Microelectronics and Packaging Society

Vol: 26(1)

Page: 29-33

Link: https://scienceon.kisti.re.kr/srch/selectPORSrchArticle.do?cn=JAKO2019… 210회 연결

Kim, G., Kang, G., and Kwon, D.*, (2019) “Effect of Material Property Uncertainty on Warpage during Fan Out Wafer-Level Packaging Process,” Journal of Microelectronics and Packaging Society, vol. 26(1), pp. 29-33.