Warpage Simulation during Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties > Journal

Warpage Simulation during Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties

Author: Kim, G., and Kwon, D.

Year: 2021

Journal: Journal of Nanoscience and Nanotechnology

Vol: 21(5)

Page: 2987-2991

IF: IF: 1.134, 77.12%

Link: https://pubmed.ncbi.nlm.nih.gov/33653469/ 420회 연결

Kim, G., and Kwon, D.*, (2021) “Warpage Simulation during Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties,” Journal of Nanoscience and Nanotechnology, vol. 21(5), pp. 2987-2991. (IF: 1.134, 77.12%)