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Reduction in electronic package design processes through AI-based surrogate models

Author: Lee, J., Kwon, D.

Year: 2025

Journal: JMST Advances

Link: https://doi.org/10.1007/s42791-025-00106-3 229회 연결

Lee, J., & Kwon, D. (2025). Reduction in electronic package design processes through AI-based surrogate models. JMST Advances, 1-6.