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AI-assisted Full-field Warpage Prediction and Optimization for Advanced Packaging

Author: Lee, J., Lee, S., Kim, T., Kwon, D.

Year: 2026

Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology

IF: IF: 3.3, 42.1%

Link: https://ieeexplore.ieee.org/document/11621985 67회 연결

Lee, J., Lee, S., Kim, T., Kwon, D. (2026) AI-assisted Full-field Warpage Prediction and Optimization for Advanced Packaging, IEEE Transactions on Components, Packaging and Manufacturing Technology.