Real-time Diagnosis of Wire Degradation based on Digital Signal Analysis

IEEE Electronic Components and Technology Conference, Lake Buena Vista, FL.,

Lee, J., and Kwon, D. 2017

Hygroscopic Swelling Behavior of 3D Printed Parts due to Changes in Environmenta…

ASME International Design Engineering Technical Conference, Charlotte, NC,

Park, J., Ha, S., Park, E., Kwon, D.*, and Kim, N. 2016

An Approach to Monitor Interconnect Degradation for Prognostics of Electronics B…

International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Jiuzhaigou, China.,

Lee, J., Kwon, D. 2016

Service Life Estimation of Supercomputing Systems based on Low-power Processors

International Conference on Future Information & Communication Engineering, Da Nang, Vietnam.,

Shin, I., Park, J., and Kwon, D. 2016

Use of Digital Signal Characteristics for Solder Joint Failure Precursors

Electronic Components and Technology Conference, Las Vegas, NV.,

Lee, J., and Kwon, D. 2016

Systematic Dimensional Calibration Process for 3D Printed Parts in Selective Las…

ASME International Design Engineering Technical Conference, Boston, MA.,

Ha, S., Han, H., Kwon, D., Kim, N.*, Kim, H., Hwang, C., Shin, H., and Park, K. 2015

A Prognostic Method of Assessing Solder Joint Reliability Based on Digital Signa…

Electronic Components and Technology Conference, San Diego, CA.,

Yoon, J., Shin, I., Park, J. and Kwon, D. 2015

Statistical Forecasting of Material Demand through Big Data Analysis

Asia Pacific Industrial Engineering and Management Systems Conference, Jeju, South Korea.,

Yoon, J., Park, M., Yang, H., Kwon, D.*, and Song, M. 2014

Define Electrical Packaging Temperature Cycling Requirement with Field Measured …

Electronic Components and Technology Conference, Las Vegas, NV.,

Pei, M.*, Han, R., Kwon, D., Lucero, A., Vasudevan, V., Kwasnick, R., and Polasam, P. 2013

A Preliminary Solder Joint Life Prediction Model by Experiment and Simulation fo…

Electronic Components and Technology Conference, Las Vegas, NV.,

Han, R.*, Pei, M., Kwon, D., Ge, Y., Harries, R., Bhatti, P., and Zheng, T. 2013

Accelerated Stress Testing Methodology to Risk Assess Silicon-Package Thermo-Mec…

International Reliability Physics Symposium, Monterey, CA.,

Rangaraj, S.*, Kwon, D., Pei, M., Lucero, A., Hicks, J., Leatherman, G., Wilson, T., Streit, S., and He, J. 2013

Optimized Reliability Test Design to Reduce Uncertainties in Reliability Assessm…

Electronic Components and Technology Conference, San Diego, CA.,

Kwon, D.* and Lucero, A. 2012

Degradation of Digital Signal Characteristics due to Intermediate Stages of Inte…

IEEE Workshop on Signal Propagation on Interconnect, Hildesheim, Germany.,

Kwon, D., Azarian, M. H.*, and Pecht, M. 2010

Kwon, D., Azarian, M. H.*, and Pecht, M.

IPC APEX Expo, Las Vegas, NV.,

Comparative Analysis of Interconnect Degradation using RF Impedance and Event Detectors 2010

Use of Skin Effect for Detection of Interconnect Degradation

International Microelectronics and Packaging Society, San Jose, CA.,

Azarian, M. H.*, Kwon, D., and Pecht, M. 2009