Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblie…

IEEE Electronic Components and Technology Conference, San Diego, CA.,

Kwon, D., Azarian, M. H.*, and Pecht, M. 2009

Identification of Interconnect Failure Mechanisms Using RF Impedance Analysis

IEEE Workshop on Signal Propagation on Interconnect, Strasbourg, France.,

Kwon, D., Azarian, M. H*., and Pecht, M. 2009

Early Detection of Interconnect Degradation Using RF Impedance and SPRT

IEEE Prognostics and Health Management Conference, Denver, CO.,

Kwon, D., Azarian, M. H*., and Pecht, M. 2008

Detection of Solder Joint Degradation Using RF Impedance Analysis

IEEE Electronic Components and Technology Conference, Lake Buena Vista, FL.,

Kwon, D., Azarian, M. H.*, and Pecht, M. 2008

Effect of Solder Joint Degradation on RF Impedance

IEEE Workshop on Signal Propagation on Interconnect, Avignon, France,

Kwon, D., Azarian, M. H.*, and Pecht, M 2008