Accelerated Stress Testing Methodology to Risk Assess Silicon-Package Thermo-Mechanical Failure Modes Resulting from Moisture Exposure under Use Conditions > Conference

Accelerated Stress Testing Methodology to Risk Assess Silicon-Package Thermo-Mechanical Failure Modes Resulting from Moisture Exposure under Use Conditions

Author: Rangaraj, S.*, Kwon, D., Pei, M., Lucero, A., Hicks, J., Leatherman, G., Wilson, T., Streit, S., and He, J.

Year: 2013

Journal: International Reliability Physics Symposium, Monterey, CA.

Link: https://ieeexplore.ieee.org/document/6532032 301회 연결

Rangaraj, S.*, Kwon, D., Pei, M., Lucero, A., Hicks, J., Leatherman, G., Wilson, T., Streit, S., and He, J. (2013) “Accelerated Stress Testing Methodology to Risk Assess Silicon-Package Thermo-Mechanical Failure Modes Resulting from Moisture Exposure under Use Conditions,” IEEE International Reliability Physics Symposium, Monterey, CA.