A Preliminary Solder Joint Life Prediction Model by Experiment and Simulation for Translation of Use Condition to Temperature Cycling Test Condition > Conference

A Preliminary Solder Joint Life Prediction Model by Experiment and Simulation for Translation of Use Condition to Temperature Cycling Test Condition

Author: Han, R.*, Pei, M., Kwon, D., Ge, Y., Harries, R., Bhatti, P., and Zheng, T.

Year: 2013

Journal: Electronic Components and Technology Conference, Las Vegas, NV.

Link: https://ieeexplore.ieee.org/document/6575669 181회 연결

Han, R.*, Pei, M., Kwon, D., Ge, Y., Harries, R., Bhatti, P., and Zheng, T. (2013) “A Preliminary Solder Joint Life Prediction Model by Experiment and Simulation for Translation of Use Condition to Temperature Cycling Test Condition,” IEEE Electronic Components and Technology Conference, Las Vegas, NV.