A Prognostic Method of Assessing Solder Joint Reliability Based on Digital Signal Characterization > Conference

A Prognostic Method of Assessing Solder Joint Reliability Based on Digital Signal Characterization

Author: Yoon, J., Shin, I., Park, J. and Kwon, D.

Year: 2015

Journal: Electronic Components and Technology Conference, San Diego, CA.

Link: https://ieeexplore.ieee.org/document/7159886 275회 연결

Yoon, J., Shin, I., Park, J. and Kwon, D.* (2015) “A Prognostic Method of Assessing Solder Joint Reliability Based on Digital Signal Characterization,” IEEE Electronic Components and Technology Conference, San Diego, CA.