Use of Digital Signal Characteristics for Solder Joint Failure Precursors > Conference

Prognostics and Health Management

Publications

Journal
Conference

Publications
Conference

Conference

Use of Digital Signal Characteristics for Solder Joint Failure Precursors

Author: Lee, J., and Kwon, D.

Year: 2016

Journal: Electronic Components and Technology Conference, Las Vegas, NV.

Link: https://ieeexplore.ieee.org/abstract/document/7545520?section=abstract 139회 연결

Lee, J., and Kwon, D.* (2016) “Use of Digital Signal Characteristics for Solder Joint Failure Precursors,” IEEE Electronic Components and Technology Conference, Las Vegas, NV.