Prognostics and Health Management
Publications
Journal
Time Reduction for Package Warpage Optimization based on Deep Neural Network and Bayesian Optimization
- Vol
- 31(3)
- Page
- 50-57
- Link
- https://doi.org/10.6117/kmeps.2024.31.3.050 162회 연결
Lee, J., & Kwon, D. (2024). Time Reduction for Package Warpage Optimization based on Deep Neural Network and Bayesian Optimization. Journal of the Microelectronics and Packaging Society, 31(3), 50–57.