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Remaining Life Prediction of Solder Joints Using RF Impedance Analysis and Gaussian Process Regression

Author: Kwon, D.*, Azarian, M. H., and Pecht, M.

Year: 2015

Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology

Vol: 5(11)

Page: 1602-1609

IF: IF: 1.660, 54.62%

Link: https://ieeexplore.ieee.org/document/7274700 384회 연결

Kwon, D.*, Azarian, M. H., and Pecht, M. (2015) “Remaining Life Prediction of Solder Joints Using RF Impedance Analysis and Gaussian Process Regression,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5(11), pp. 1602-1609. (IF: 1.660, 54.62%)