From April 1 to 3, 2026, Professor Daeil Kwon, Ph.D. candidate Jungeon Lee, and M.S. candidate Soyeon An attended the 2026 Annual Conference of the Korea Microelectronics and Packaging Society held at Songdo Convensia. Ph.D. candidate Jungeon Lee delivered an oral presentation titled "Efficient Full-field Warpage Optimization of Advanced Packages Using cGAN and NSGA-II Surrogate Modeling." M.S. candidate Soyeon An also delivered an oral presentation titled "Enhancing Warpage Prediction of Advanced Packages Using Feature Map-Based Loss Function Design."